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Key Updates on NVIDIA Vera Rubin/VR200 NVL72 (Integrating my latest supply chain checks and NVIDIA CEO Jensen Huang’s CES 2026 keynote) 1. NVIDIA has renamed the AI server VR200 NVL144 (die-based) to VR200 NVL72 (package-based). My supply chain checks indicate VR200 NVL72 will be offered in two power profiles: Max Q and Max P. ➢ Jensen referenced NVL72, rather than the previously used NVL144 naming. ➢ Max Q and Max P share the same hardware design. ➢ Max Q GPU/rack power (TGP/TDP): ~1.8/190 (kW). ➢ Max P GPU/rack power (TGP/TDP): ~2.3/230 (kW). ➢ Both are meaningfully higher than GB300 NVL72 at 1.4/140 (kW). ➢ Offering two power profiles improves deployment flexibility under data-center power constraints. It also suggests NVIDIA is increasingly factoring real-world physical infrastructure limits into product specifications. 2. VR200 NVL72 upgrades the GPU thermal solution for both MaxQ and MaxP. ➢ Both use a micro-channel cold plate (MCCP) paired with a gold-plated lid. ➢ The market has been expecting a move to a micro-channel lid (MCL) once GPU TGP reaches 2.3 kW; however, MCL mass production is unlikely before 2H27. 3. Benefiting from upgrades across the GPU, HBM, and NVLink Switch, VR200 NVL72 delivers roughly 3.5×/5× the training/inference AI computing power of GB300 NVL72, driving a sharp increase in rack-level power demand. ➢ VR200 NVL72 upgrades power shelves to 3*3U 110 kW (6*18.3 kW PSUs), vs. the most common GB300 NVL72 configuration of 8*1U 33 kW shelves (6*5.5 kW PSUs). ➢ VR200 NVL72 power shelves adopt an 3+1 redundancy design. ➢ VR200 NVL72 raises the power whip rating to 100A (vs. 60A for GB300 NVL72), tightening data-center power infrastructure requirements (e.g., busway and tap-off boxes). 4. VR200 NVL72 relies even more heavily on liquid cooling. ➢ Both the compute and NVSwitch trays adopt a fanless design. ➢ Rack technology cooling system flow (TCS flow) nearly doubles (~+100%) vs. GB300 NVL72, benefiting spec and/or count upgrades for CDUs, manifolds, cold plates, and quick disconnects (QDs). ➢ Rack airflow requirements fall by roughly 80% (in CFM) vs. GB300 NVL72. 5. VR200 NVL72 compute tray adopts a midplane for the first time, enabling a truly cableless design. ➢ Key midplane specs include 44 layers (22+22), M9 CCL (EM896K3), and an approximate size of 420×60 mm. ➢ Jensen noted that this design can reduce compute-tray assembly time from roughly two hours to about five minutes (vs. GB300 NVL72). 6. Rubin CoWoS are estimated at 300–350k wafers in 2026, with pilot production expected in early 1Q26 and mass production by late 2Q26. VR200 NVL72 rack assembly is expected to enter mass production by the end of 3Q26; factoring in yield ramp, 2H26 rack shipments are estimated at ~5,000–7,000 units. 7. Once rack power approaches ~200 kW, 54V distribution begins to face material constraints in space (busbars/cabling) and conversion efficiency. As a result, VR200 NVL72 can be viewed as the final generation of the Oberon rack architecture. To address the rising rack-power requirements driven by continued AI compute scaling, NVIDIA is expected to transition to the next-generation Kyber rack design, which supports 800V HVDC.