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Open original source ↗Clients of SemiAnalysis Memory and Accelerator model knew about Rubin Ultra 16 Hi to 12 Hi cut in March :) https://t.co/1ZerQ0igsF
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LMAO Rubin Ultra's HBM literally got downgraded to 12 Hi, and they are not even using HB yet They won't use 16 Hi in 2027 Hybrid Bonding is very expensive for HBM rn (yields are abysmal) The big near-term upside for BESI is that TSMC's COUPE & Tower use Hybrid Bonding for EIC + PIC integration for CPO
zephyr_z9 ↗