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Open original source ↗I wanted to use this photo because it's the actual package and looks way cooler.
The black area above is the DRAM but not milled yet.
Cross section from our Hitachi XTEM coming soon 🤫 https://t.co/iWyTyW4rRP
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We took the silicon out of the silicon. Quick turn from SemiAnalysis STEEL Teardown Lab: iPhone 18 Pro Max, A20 silicon on TSMC N2. more to follow... https://t.co/RURlD49MP1
SemiAnalysis_ ↗