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N2 wafers take ~14 weeks to be fabricated across thousands of steps + couple months for packaging assembly The absolute soonest a product can come out with N2 is ~Q2 2026 Apple has always known/planned chips codenamed Theras, Tilos, Hidra, Sotra, Baltra, Isonoe to be N3P 2/4 Apple will release their first products with N2 in 2026, on schedule, as planned They are increasing use of N-1 nodes with SoIC in their high end APs to keep costs down despite large wafer price increases Apple's focused on wide IO copackaged memory to keep perf gains going 3/4 Nvidia and Qualcomm have no faith in Samsung Samsung is~3 years behind TSMC in PPA at this point, and even ~1 year behind Intel Nvidia and Qualcomm always test new nodes at Samsung, and now also testing Intel Neither plans to move their highest volume products away from TSMC 4/4