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Intel EMIB advanced packaging has become a confirmed rival to TSMC with strong yields and satisfied customers, media report, citing unnamed supply chain sources, who say Intel’s work with clients Google and MediaTek has been so smooth it indicates that costs and production yields are meeting targets. And with TSMC CoWoS capacity still tight, clients are likely to deepen work with Intel. $INTC $TSM $GOOGL #mediatek #semiconductors https://t.co/h4Bm35spoO EMIB: Embedded Multi-die Interconnect Bridge CoWoS: Chip-on-Wafer-on-Substrate