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Semiconductor testing firms WinWay and Chunghwa Precision both plan to speed up capacity expansion amid strong AI chip-testing demand, media report, with WinWay expanding socket capacity 50% by the 3rd quarter 2027, and Chunghwa Precision also 50% by March 2027. WinWay also said it currently has over a dozen Co-Packaged Optics (CPO) projects, which are more complex than AI chip testing projects. Production of small CPO volumes are expected to start in the 2nd half of 2027. Links: https://t.co/xZFJUiQJ7P https://t.co/6yQybljHHX https://t.co/GHSKQQRhF8