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TSMC has inspected two AUO plants in the Central Taiwan Science Park for possible purchase and transformation into advanced semiconductor packaging facilities, media report, noting both plants are near TSMC facilities. AUO has sold 3 plants so far this year for a total NT$34.7 billion (US$1.1B). The company used to be one of the world’s biggest makers of LCD panels, which it still produces, but it has been transforming its business to higher end products like specialty screens, Micro LED and advanced semiconductor packaging. $TSM https://t.co/6wutDt3cv7 Related: TSMC’s visits to AUO plants may also have to do with its plans for CoPoS advanced packaging (Chip-on-Panel-on-Substrate), moving to packaging square silicon panels instead of round silicon wafers as AI chip sizes continue to grow, media report, adding TSMC’s 3DIC R&D lab in Japan has done substantial glass substrate work, including TGV (Through Glass Vias) development, etc. The report lists Taiwan partners and equipment providers for CoPoS, including Innolux, Contrel, E&R Engineering, Scientech, All Ring, C Sun, Grand Process Tech, more. $TSM https://t.co/BfkrNlWfLh