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TSMC plans to raise prices 3% to 6% in January 2027, with higher increases for advanced manufacturing processes, DigiTimes reports, adding TSMC’s visibility now extends to 2030. Prices for older chips and specialty processes will also rise, as TSMC’s older fabs are running full (utilization) amid strong AI demand for power management chips (PMIC), microcontrollers, (MCUs), MOSFETs, MEMs, driver ICs, etc., as well as advanced packaging related: optical communications, silicon interposers, etc. Rival foundries are likely to follow TSMC’s price increases. The report also says TSMC price increases are likely to continue due to cost pressures from building fabs overseas, as US fabs cost 4 to 5 times more than Taiwan. The report cites unnamed supply chain sources. $TSM #semiconductors https://t.co/kGabCVjI0h Note: The journalist who wrote the report is excellent, routinely nailing scoops long before the market. One note here is that TSMC is mostly offloading 8-inch/6-inch business to Vanguard (VIS), which the report makes no mention of. VIS is taking on clients, some equipment, and is also raising prices. The changeover will take time. TSMC is converting the older fabs for other uses, including advanced packaging. Note 2: The article specifically says the price hike is for "Wafer Out" meaning the finished wafer only, not including packaging, testing, etc.