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Open original source ↗SK Hynix confirmed it will use Intel’s EMIB advanced packaging for next-gen HBM memory chips, joining Apple, MediaTek and other top TSMC clients in a win for Intel, media report, adding the victory is mainly due to the continued shortage of TSMC’s CoWoS capacity. $SKHY $INTC $TSM $AAPL #semiconductors https://t.co/nlfJmPxs2T