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Samsung Electronics aims to reach mass production on FOPLP (Fan-out Panel Level Packaging) by 2028, media report, adding its decades of work in display panels mean it’s taking a very different path than TSMC. Both are moving to rectangular shaped substrates – Samsung on 415 x 510 mm panel format, TSMC on 310 x 310 mm – but Samsung’s past work focused on mature chips. It’s expanding the effort to high-performance chips by 2028. TSMC, which calls its offering CoPoS (Chip-on-Panel-on-Substrate), is designed for high-end graphics chips (GPUs), custom ASICs, and other HPC (high-performance computing) chips. $TSM $SSNLF #Samsung #FOPLP #semiconductors https://t.co/NDhieNqAP6