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ZDT, the PCB giant, will invest NT$56.8 billion (US$1.8B) to boost production of substrates used in advanced packaging, media report, noting funds will be used for a new production campus in Shenzhen, China. ZDT said 2026 capex is expected to be over NT$80 billion, which it believes is the biggest in the industry, and spending will remain elevated in 2027 and 2028 due to strong demand related to AI servers. ZDT currently has 13 plants under construction and 16 being planned. Zhen Ding Technology https://t.co/SOVRg4olBR #Unimicron #Kinsus #NanYaPCB https://t.co/eB6yVSsfRu