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TSMC’s OIP Forum 2026 kicks off in Silicon Valley on Sep. 23, followed by Hsinchu Nov. 12 focused on advanced manufacturing processes and advanced packaging (3D IC multi-die architectures, CoWoS, SoIC and Co-Packaged Optics (Silicon Photonics), media report, noting keynotes include Nvidia, Arm, MediaTek, Synopsys and more. https://t.co/YzNUk17kQ0