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Real FeRAM work, and a strong Intel/Micron/Berkeley/Cornell team. The pitch is AI memory without EUV. I’ll believe it when the parts qualify. Too many “next memory” stories die on yield, volume, and integration – the same problems that held classic FeRAM back.

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We are proud to announce @keplercompute. Our mission is unlock computing for everyone by pushing memory and logic to the limits of physics. Our team co-led one of the industry's first 3D chip-stacking technologies, has led and scaled seven generations of DRAM and multiple logic designs into billions of chips. We built the world's first commercial physical synthesis tool and techniques at the heart of the logic design industry and solved long standing challenges in ferroelectrics, invented beyond CMOS logic devices. We would love to work with you to reinvent chip manufacturing here in America. Memory is the biggest binding constraint on AI compute. Today we come out of stealth after a 7 year bet on this problem - introducing a new frontier of AI memories - that approach the bandwidth per watt of SRAM and go up to 10x beyond the capacity of SRAM and HBM. We raised $468m, built a dedicated fab and our AI memories sample this year and ramp to production next year. We are allocated for 2027 and will be scaling in America by 2028. We are open for business get in touch to work together. We are also growing the group of Keplerians and would love to work with you. Learn More @ Kepler: https://t.co/lW0ZPLtrkx Read our story in @WIRED: https://t.co/j6pvkMvmzR

keplercompute ↗
Library as of 2026-10-22