Dan Nystedt

Samsung Foundry is prioritizing expansion of 2nm capacity and performance over 1.4nm, with the 2nd and 3rd versions of 2nm process family, SF2P and SF2P+ in mass production next year, media report, adding the focus on 2nm will put it in a better position to compete for AI accelerator chip orders. The downside is Samsung pushed out 1.4nm mass production to 2029, from a prior timeline of 2027. TSMC’s A14 process is set to enter mass production in 2028. $SSNLF $TSM #Samsung #semiconductors https://t.co/3cdArsxDNj

Rumor: Intel’s upcoming desktop PC processor, Razor Lake, will use TSMC’s high performance N2X process (2nm), media report. If accurate, it would mean Intel was expanding its use of TSMC 2nm family processes, with Nova Lake to use TSMC’s N2P in addition to Intel 18A. Nova Lake, the next-gen desktop PC processor, will introduce bLLC (Big Last-Level Cache), designed to compete with AMD’s 3D V-Cache, while the laptop version may be delayed until the Razor Lake-HX generation. $INTC $TSM #semiconductors https://t.co/LQZv87aoZR

Samsung Foundry has raised chip manufacturing prices up to 15% amid a spike in demand, Reuters reports. -Samsung's SF4 (4nm) node prices rose 10%-15% in July, over June, for US & China clients. -The SF4 line at its Pyeongtaek plant has been full since late last year. -Demand from China particularly strong $SSNLF $TSM $INTC #Samsung #semiconductors https://t.co/NfSDkHToBT

Tragedy struck at TSMC’s Fab 20 as a worker was crushed by electrical equipment, media report, saying the equipment was being moved and started to slide out of control, killing the 22-year old man, who was unable to get out of the way in time. $TSM #semiconductors https://t.co/1upJk8xngG

Three of Taiwan’s top chip design houses have invested in new data centers for more R&D compute, media report: -MediaTek (smartphone chips, custom ASICs, more): Opened the first of three phases at its new Tongluo R&D data center in May, aimed at R&D across AI and high performance computing, advanced node chip designs and advanced packaging. -Global Unichip (GUC, custom ASICs, more): Its Zhunan data center began trials in the 2nd quarter and is for chip design work on advanced 3nm, 2nm and below nodes, custom ASICs and advanced packaging design. -Novatek (custom ASICs, more): Broke ground July 28 on an NT$2.9B R&D data center for own product d…

Foxconn, the AI server giant, is investing US$358.4 million (NT$11.5 billion) in Vietnam for more Co-Packaged Optics capacity there, after entering mass production in the 3rd quarter, media report. Foxconn also plans to spend NT$859 million in Mexico to buy 243,027.8 sq. meters of land, believed to be for future AI server capacity. $NVDA $AMZN $GOOGL $MSFT $META https://t.co/kQafx9Wocd

Printed circuit board makers (PCBs) are whispering a fresh round of price hikes in the 2nd half 2026 to cope with continued materials price increases, media report, such as for CCL (copper-clad laminates), and prepreg. First half price hikes ranged from 5%-30%. The AI wave has caused prices to surge as companies scramble to build new plants to meet demand. CCL prices rose 20%-30% in the 1st half, and will continue up in the 2nd. PCB maker Chin-Poon Industrial said 1st half price hikes helped it pass 70%-80% of cost increases on to clients. #servers #PCB #CCL https://t.co/qZOEmgPAgd

Acer Chairman: PC shipments may plunge over 20% in the 2nd half of 2026 as higher prices bite, media report, with the PC giant planning to focus on new businesses to maintain growth. Chair Jason Chen also said price increases for memory chips and SSDs have started to plateau, so PC price hikes have also slowed. $DELL $HPQ $MU $SKHY #semiconductors https://t.co/zcPvtGyEMc

Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $INTC $TSM $ASX $GOOGL $NVDA #semiconductors https://t.co/2Z7xBrwUgj

Taiwan raised its 2026 economic growth forecast to 11.05%, the highest annual rate in 39-years, boosted by strong AI-related demand, media report, adding the government is readying plans to pay NT$10,000 (US$315) to all residents as long as the budget is balanced with zero-net borrowing. The payout could come as early as the Lunar New Year holiday (Feb. 4-10, 2027). https://t.co/xiJwTA3BS7

The board of Wafer Works, the silicon wafer maker, approved NT$15.95 billion in capex to expand production, media report, with capacity to rise to 100,000 wafers per month by mid-2027. The firm mainly produces silicon wafers, does Gallium Nitride (GaN), and is boosting production of epitaxial wafers for CIS. #semiconductors https://t.co/kN6OieW5Ez

AI is driving strong demand for mature process chip manufacturing, so more price hikes are on the way, media report. Last week, China’s top chip foundry SMIC said it hiked 3rd quarter prices on key technologies. Taiwan media say 15%-20% price increases this year are just the beginning – more are in store for 2027. Taiwan’s UMC, Vanguard International (VIS) and Powerchip all face upside next year as utilization rates continue to rise and AI-related demand remains strong. $UMC $GFS $SKYT #semiconductors https://t.co/P6v4kLzpvb

Taiwan power semiconductor makers plan to hike prices 10%-15% on chips not-under-contract by October amid hot AI demand and after industry giant Infineon raised prices, media report. This is the 3rd time Taiwan firms have raised prices, up an average 15%-20% in the 1st half of 2026. Demand in the 2nd half has further strengthened. Nvidia’s AI Factory plans call for an upgrade to 800VDC, raising performance demands for all components and opening new growth for high end power chips made using SiC and GaN materials (Silicon Carbide and Gallium Nitride). $IFNNY $STM $TXN $ON $WOLF #FujiElectric #Rohm #MitsubishiElectric https://t.co/naM8FDCYLO

When Nvidia announced Spectrum-X switches built with CPO (co-packaged optics) have entered mass production, it named 4 Taiwan firms among partners, TSMC, Foxconn, ASE and Browave as well as China’s leading optics firm, TFC Communication, media report, and multiple firms say their order books are already full through 2027 and expect supplies to be tight into 2028. CoreWeave, Lambda and Oracle will become the first to deploy the 200Gbps/lane CPO Ethernet switch system, billed for a big leap in performance: 5x improvement in network power efficiency 5x increase in continuous AI uptime 10x extension in Mean Time Between Failures (MTBF) Up to 1.6…

The US plans to tell dozens of nations they must pick sides in its AI race with China, Reuters reports. The US won 35 signatories to the AI Opportunity Statement for cooperation on AI models, and dozens of nations to the Pax Silica supply chain resilience initiative. China responded by launching the World Artificial Intelligence Cooperation Organization to promote open-weight AI models. Kazakhstan is the only nation so far to have joined both initiatives, a nation potentially rich in critical minerals needed by the US side. #semiconductors #AI https://t.co/BBbTVuHN1G

Rumor: Apple will unveil a foldable iPhone alongside the next-generation iPhone 18-series on Sept. 9 in the US, media report, adding supplier Foxconn has kicked manufacturing into high gear and stepped up recruitment at its main iPhone campus in Zhengzhou, China, offering 8,800 yuan (US$1,225) signing bonuses to encourage workers to return by mid-August (14th, 15th). $AAPL $TSM #iPhone https://t.co/coQLlaWHHc

TSMC Arizona’s 2nm fab may arrive as much as four-quarters earlier than expected, media report, amid speedy progress on the chip giant’s 3rd fab (P3) in Phoenix. The 2nd fab is also ahead of schedule, with equipment set to be installed in the 2nd half of 2026 (now), and mass production expected in the 2nd half of 2027. $TSM $NVDA $AAPL $AMD $GOOGL $AMZN #semiconductors #Arizona https://t.co/LFCXNBuckr

Prices of Indium Phosphide (InP) substrates and epi-wafers are set to jump over 10% in the 4th quarter – the biggest price hike in history – as the AI-driven optical communications boom causes severe shortages, media report. One supplier reportedly said inventory is so tight that “even with cash, you might not get anything.” InP substrate prices have risen for three consecutive quarters and are heading into a fourth, while epi-wafers are entering their third consecutive increase. Valued for high-frequency, high-speed data transmission, InP is a critical material as AI data centers shift from copper to optical interconnects (optics in, coppe…

TSMC’s investments in Arizona, USA and Kumamoto, Japan are paying off, contributing to TSMC’s net profit in the 1st half of 2026, media report: TSMC Arizona NT$31.15 billion (US$973M) up from NT$4.52B in 2025 Japan (JASM) NT$1.22 billion, turning profitable vs last year's loss (NT$4.52B) 1/3 $TSM https://t.co/LFCXNBuckr 2/3 TSMC’s operations in China also contributed to its net profit in the 1st half of 2026: TSMC China NT$5.84 billion up from NT$5.60B last year TSMC Nanjing NT$14.90 billion, up from NT$14.44B 3/3 Subsidies: TSMC received a combined NT$590.4 million in government grants from the US, Germany, Japan and China for local pl…

Nvidia’s next generation chip platform, Feynman is ahead of schedule, will use TSMC’s A16 process, and CPO (co-packaged optics), DigiTimes reports, with TSMC full speed ahead to meet 2028 mass production. -Nvidia is rapidly shifting its supply chain to put Feynman out in the 2nd half of 2028 -Feynman uses 3D chiplets, SoIC packaging and CPO. (Silicon-on-Integrated-Chips). -Total rack bandwidth for Feynman to hit 1,000 TB/s versus 260 TB/s for Rubin and 520 TB/s for Rubin Ultra, making CPO vital. -TSMC construction at advanced packaging plants AP7 in Chiayi and AP8 in Tainan are ahead of schedule, and accelerating -SoIC, CoWoS-L and CoPoS are …

Cerebras Systems CEO Andrew Feldman listed 2 key advantages over rivals, media report: -It uses TSMC’s 5nm process to manufacture its chips, with plentiful supply, in contrast to 3nm and 2nm production. -Uses on-chip SRAM for memory instead of HBM memory chips, which continue to go up in price. TSMC makes the on-chip SRAM. $TSM $CBRS #semiconductors https://t.co/YYKnQ3tjJF

Taiwan prosecutors have indicted a former senior R&D engineer at DRAM maker Nanya Technology for attempting to steal technology and defect to China for a high-paying job, media report, noting Mr. Yeh hid a camera inside a bag of snacks to avoid detection, then photographed & videoed 32 items related to core manufacturing process technologies. He confessed during the investigation. https://t.co/LnBht8PY6J

Taiwan DRAM maker Nanya Tech plans to build new 12-inch wafer fabs in Yunlin and Pingtung, Taiwan for DRAM and customized DRAM, media report. -The Yunlin fab will focus on sub-10nm process node products for AI. -Nanya’s latest project, the NT$300 billion Linkou 5A DRAM fab, due for mass production in 2028 -Media quote a Nanya executive confirming plans for additional new fabs, but declining to comment where. $AMAT $ASML $LRCX $KLAC $TOELY #semiconductors https://t.co/w5WVYgIti0

Quanta, the AI server giant, said order visibility extends into 2028, and the CFO is “very excited” about the next 2-years, at its 2nd quarter investors’ conference, media report: -Capex raised to NT$40 billion from NT$30 billion -AI server capacity will double by end-2026 vs last year. -2028 AI server capacity to double again vs 2026. -AI servers accounted for 75-80% of total server revenue -In the 3rd quarter, AI server revenue will grow by a double-digit percent vs Q2 -For full year 2026, AI server revenue will double vs 2025 -Top 5 CSPs/Hyperscalers are all Quanta clients -It has also won AI server and ASIC server orders from Neo Clouds -…

Pegatron expects over 10-fold growth in AI server revenue this year amid strong demand for Nvidia GB-series, B200 and B300-platform servers, executives said, media report, adding Pegatron’s AI server business has expanded Neo Cloud clients to now including Hyperscalers as well, and full L11 & L12 models. Pegatron’s 2nd quarter net profit rose 1,463.8% year-on-year to NT$4.49 billion. $CRWV $NBIS #AIservers https://t.co/FkiqZcDwBj

Semiconductor test and metrology have become the key factor in AI chip yield, cost, performance and mass production speed, moving this formerly behind-the-scenes work to the fore, media report, citing SEMI Taiwan President Terry Tsao. Instead of just catching defects, modern test and metrology equipment now feeds real-time insights back to the design, fabrication and packaging stages for faster troubleshooting. System-Level Testing (SLT), burn-in testing, and reliability verification have all moved up in importance. #Advantest $TER $AMAT $KLAC $ONTO $NVMI https://t.co/uatbDps9qW

Asustek raised its full-year server business sales growth forecast to 150% from 100% previously, media report, adding server sales grew 200% year-on-year in the 2nd quarter. Asustek’s PC business grew 20% in the quarter, and is expected to grow 15%-20% in Q3. https://t.co/WNsU4oAaQh

Nvidia Vera Rubin-based AI servers begins mass production in the 3rd quarter at Foxconn, and shipments will ramp up in the 4th quarter, media report, adding Foxconn has won new ASIC customers as well, putting it closer to its goal of 50% market share in AI server racks. CEO Mike Chiang made the comments during Foxconn’s 2nd quarter conference Wednesday (8/12). Foxconn remains on target for AI rack shipments to more than double this year. Foxconn 2nd quarter net profit rose 35% year-on-year to NT$59.97 billion (US$1.86B), beating the NT$58.38B expected. For the 3rd quarter, Foxconn expects significant quarter-on-quarter growth, and strong ye…

Zhen Ding Technology (ZDT), the world’s biggest printed circuit board maker (PCB), saw revenue from servers, optical modules and substrates rise 113% year-on-year in the 1st half of 2026, media report, adding executives said they accounted for 21.6% of total revenue of NT$89.2 billion, up from 11.7% last year. ZDT plans to spend NT$80 billion on capex this year, with investment continuing into 2027-2028. https://t.co/YOCEQSQ2L1

Compal Electronics’ new Texas, USA AI server plant will ramp up production in 2027 as part of a build out including Vietnam and Taiwan that will see Compal's AI server business grow to 30% - 40% of total revenue, media report, citing Chairman Ray Chen at a plant opening ceremony Tuesday (8/11). Compal, one of Taiwan’s top electronics assembly giants, was late to the AI server market, behind rivals Foxconn, Wistron, Quanta, Inventec and others. $NVDA #AIservers https://t.co/Lv0obtJdnV